The company was founded in 1992 and listed on the Shenzhen Stock Exchange in 2007. It is a high-tech enterprise specializing in the development, production and sale of various basic semiconductor packaging materials such as lead frames and bonding wires. Downstream packaging products are widely used in many fields such as “5G”, automotive electronics, artificial intelligence, photovoltaic power generation, industrial automation control, consumer electronics, green lighting, screen backlighting, and the Internet of Things. The company is a high-tech enterprise specializing in the development, production and sales of various semiconductor packaging materials. The company's main business is the manufacture and sale of semiconductor packaging materials such as lead frames and bonding wires. The company's main products: lead frame products, bonding wires, electrode wires, high-precision molds. The company's honors include the Ningbo Red Cross Charity Merit Award, the Yinzhou District Charity Model Enterprise title, and the 2013 National Outstanding Innovative Enterprise in the Electronic Information Industry.
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