About Tianshui Huatian Technology Company

The company was founded on December 25, 2003 and successfully listed on the Shenzhen Stock Exchange on November 20, 2007. Mainly engaged in integrated circuit packaging testing business. As a well-known global integrated circuit packaging and testing company, Huatian Technology provides customers with one-stop services such as package design, packaging simulation, leadframe packaging, substrate packaging, wafer level packaging, wafer testing and functional testing, and logistics distribution. With advanced technical capabilities, system-level production and quality control, it has become the preferred brand in the integrated circuit packaging and testing business. The company's main business is integrated circuit packaging testing. The company's integrated circuit packaging products mainly include DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/TQFP, QFN/DFN, BGA/LGA, FC, MCM (MCP), SiP, WLP, TSV, Bumping, MEMS, Fan-Out, etc. Corporate honors include the Gansu Enterprise Technology Innovation Demonstration Award, the 2014 China Top Ten Semiconductor Packaging Testing Companies, and the 8th (2013) China Semiconductor Innovative Products and Technology. It has won honors and titles such as “Trustworthy Brand in the Chinese Semiconductor Market”, “The Most Influential Company in the Chinese Semiconductor Market”, and “China's Top Ten Semiconductor Packaging Testing Companies”.