Express News | Shennan Circuits: The overall utilization rate of the factory has increased compared to the same period last year.

BreakingsMar 1 17:32

Shennan Circuits (002916.SZ): ABF-type packaging substrates have mass production capability for FC-BGA products with 16 layers or less and prototype manufacturing capability for more than 16 layers.

On February 7, Gelonghui reported that Shennan Circuits (002916.SZ) stated during a specific audience research that the company's packaging substrate products cover a wide variety, including module-type packaging substrates, storage-type packaging substrates, and application processor chip packaging substrates, mainly applied in mobile smart terminals, Servers/storage and other fields. The company currently has the mass production capability for BT-type packaging substrates, including full coverage of WB and FC packaging forms. The ABF-type packaging substrates have the mass production capacity for FC-BGA products with 16 layers and below, as well as sample manufacturing capability for above 16 layers, along with relevant customer certifications and production capacity.

Gelonghui FinanceFeb 7 22:39

Shennan Circuits (002916.SZ): The Nantong Phase IV project is progressing in an orderly manner with the CSI Construction & Engineering Index, aiming to build a PCB technology platform capable of covering HDI and other capabilities.

On February 7, Gelonghui reported that Shennan Circuits (002916.SZ) stated during a specific audience survey that the company has factories for its PCB Business in Shenzhen, Wuxi, Nantong, and a project in Thailand (under construction). On one hand, the company can enhance production efficiency and release some capacity through the continuous technological transformation and upgrading of existing mature PCB factories; on the other hand, the company still has land reserves at the Nantong base and is capable of building new factory premises. The construction project in Nantong Phase IV is progressing in an orderly manner with the intention of establishing a PCB technology platform capable of covering HDI and other capabilities. The company will combine its own Operation.

Gelonghui FinanceFeb 7 22:37

The 2024 public offering "Champion Fund" has disclosed its quarterly report! Last year's internal return reached 69.23%, with a heavy investment in AI computing power and application sectors.

The public offering 'Champion Fund' discloses its quarterly report for 2024.

Zhitong FinanceJan 21 21:31

Shennan Circuits (002916.SZ): AVIC Industry Investment intends to privately transfer 0.27% of its shares to AVIC Technology Innovation.

On January 16, Glorious Horizon reported that Shennan Circuits (002916.SZ) announced that on January 16, 2025, Shennan Circuits Co., Ltd. received a notice from its shareholder AVIC Industry Investment Co., Ltd. (hereinafter referred to as "AVIC Investment") that AVIC Investment intends to transfer its 1,393,792 shares in the company (accounting for 0.27% of the company's total shares) to AVIC Technology Innovation Co., Ltd. (hereinafter referred to as "AVIC Technology Innovation") through a private agreement. After the completion of this agreement transfer, AVIC Investment will no longer hold shares in the company, and AVIC Technology Innovation will directly hold 1,393,792 shares in the company (accounting for the company's...

Gelonghui FinanceJan 16 21:15

Express News | Shennan Circuits: Under the same control, Shareholders intend to privately negotiate the transfer of company shares.

BreakingsJan 16 20:19