Junma Semiconductor Materials was founded in 2006 and is an innovative technology company founded by Professor Zhou Zhenji and Dr. Zhou Boxuan. We serve the semiconductor and microelectronics packaging industry, focusing on developing advanced materials and introducing advanced and innovative solutions for semiconductor packaging, LED packaging and COB packaging manufacturers; we specialize in the design, production and sale of a full range of special materials such as bonding wires, encapsulating silicones, epoxy resin encapsulants and adhesives.
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