uBot Incorporated Limited was founded in November 2005, headquartered in Hong Kong and strategically located in Hong Kong. We have a team of experts from the semiconductor industry to provide comprehensive engineering packaging solutions and a full range of services to the back-end semiconductor transmission media industry. We have accumulated over 18 years of operating experience in providing back-end semiconductor transmission media (JEDEC trays, carriers, and related products), and over 10 years of operating experience in providing MEMS and sensor packaging. uBot has established extensive and strong relationships with major international customers in the semiconductor industry, and enjoys an excellent reputation and a good track record. Products have been sold to more than 12 countries and regions, and our product portfolio includes more than 1,500 product specifications and distributed to more than 250 delivery points.