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Nikkei Average Contribution Ranking (Pre-Close) ~ The Nikkei Average continued to decline, with Fast Retailing lowering it by about 113 yen for one stock.
As of the close on the 21st, the number of rising and falling stocks in the Nikkei average was 88 up, 133 down, and 4 unchanged. The Nikkei average continued to decline, finishing the morning trade at 38,033.22 yen, down 319.12 yen (-0.83%) from the previous day (with an estimated volume of 0.8 billion 30 million shares). On the 20th, the U.S. stock market was mixed. The dow inc was up 139.53 points at 43,408.47 dollars, while the nasdaq ended down 21.33 points at 18,966.14. Ukraine.
Three key points to focus on in the later session - semiconductor stocks fell, momentarily dropping below 38,000 yen.
During the afternoon trade on the 21st, attention should be paid to the following three points. ・The Nikkei Average continues to decline, the drop in semiconductor stocks caused it to temporarily fall below 38,000 yen. ・The dollar-yen is struggling to lower, resurfacing around 155 yen. ・The top contributor to the decline is Fast Retailing <9983>, and the second is Advantest <6857>. ■ The Nikkei Average continues to decline, the drop in semiconductor stocks caused it to temporarily fall below 38,000 yen. The Nikkei Average is down by 319.12 yen (-0.83%) at 38,033.22 yen (volume approximately 0.8 billion 30 million shares).
The Nikkei index continues to decline, temporarily falling below 38,000 yen due to the drop in semiconductor stocks.
The Nikkei average continues to decline. Ending the morning session at 38,033.22 yen, down 319.12 yen (-0.83%) from the previous day with an estimated volume of 830 million shares traded. The U.S. stock market on the 20th was mixed. The Dow Jones rose by 139.53 dollars to 43,408.47 dollars, while the Nasdaq closed trading at 18,966.14, down 21.33 points. Following reports of Ukraine launching British-made long-range missiles within Russian territory, ongoing geopolitical risks were cautioned, leading to a decline in trading after the opening.
Osaka/Kansai World Expo Pavilion Tour will be streamed on the video streaming service "Tabisuke TV"! Contributing to the development of the app and system.
Sumitomo Electric Industries, Ltd. (Headquarters: Chuo-ku, Osaka, President: Osamu Inoue, hereinafter referred to as 'the Company') is responsible for the development of the app/system, and Tokyo Travel Partners Co., Ltd. (Headquarters: Shibuya-ku, Tokyo, Representative: Shigeyuki Kurihara, hereinafter referred to as 'Tokyo Travel Partners') is in charge of operation. They have decided to live stream the appearance of Osaka and Kansai Expo pavilions on the theme of travel and health on the participatory video distribution service 'Tabi Suke TV.' The Company, Tokyo Travel Partners, and the Kansai Innovation Network
Scottish Prime Minister John Swinney inspects the construction site of our company's factory to strengthen partnership with the Scottish government.
Sumitomo Electric Industries, Ltd. (Headquarters: Chuo-ku, Osaka; President: Haru Inoue; hereinafter referred to as "the Company") has reaffirmed its cooperative relationship with the Scottish Government and stated its commitment to further actively engage in accelerating the UK's energy transition. On November 18, 2024 (local date), Prime Minister John Swinney visited the Company's subsidiary, SUMITOMO ELECTRIC U.K. POWER CABLES LTD. at Nigg Port in Scotland.
Recovery of rare metals from wastewater during flexible printed circuit manufacturing, contracting with g-resources Co., Ltd. towards international resource circulation.
Sumitomo Electric Industries, Ltd. (Headquarters: Chuo-ku, Osaka, President: Osamu Inoue, hereinafter referred to as 'the Company') has signed a contract with Digital Power Systems Co., Ltd. (Headquarters: Nishikyo-ku, Kyoto, President: Hongzhi Bai, hereinafter referred to as 'DPS') on November 8 for the recovery of rare metals used in the manufacturing process of Flexible Printed Circuits (FPC). In the manufacturing process of FPC, copper plating for electrically connecting the layered circuits and gold plating for surface treatment of connection points with external components are used.
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