By Product
Currency:CNY
2025/H1
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2021/FY
2021/H1
2020/FY
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
2009/FY
2009/H1
2008/FY
2008/H1
2007/FY
2007/H1
2006/FY
2006/H1
2005/FY
2005/H1
2004/FY
2004/H1
2003/FY
2003/H1
2002/FY
2002/H1
2001/FY
2001/H1
2000/FY
Stock NameRevenueRatio
集成电路产品销售合同1.33B98.50%
租赁业务合同15.98M1.19%
技术开发服务合同2.16M0.16%
其他业务合同2.06M0.15%
By Industry
Currency:CNY
2024/FY
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2021/FY
2021/H1
2020/FY
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
2009/H1
2008/FY
2008/H1
2007/FY
2007/H1
2006/FY
2006/H1
2005/FY
2005/H1
2004/FY
2004/H1
2003/FY
2003/H1
2002/FY
2002/H1
2001/FY
2001/H1
2000/FY
Stock NameRevenueRatio
集成电路生产及半导体材料配件2.78B98.62%
Other business38.93M1.38%
By Country/Region
Currency:CNY
2025/H1
2025/H1
2024/FY
2024/H1
2023/FY
2023/H1
2022/FY
2022/H1
2021/FY
2021/H1
2020/FY
2020/H1
2019/FY
2019/H1
2018/FY
2018/H1
2017/FY
2017/H1
2016/FY
2016/H1
2015/FY
2015/H1
2014/FY
2014/H1
2013/FY
2013/H1
2012/FY
2012/H1
2011/FY
2011/H1
2010/FY
2010/H1
2009/FY
2009/H1
2008/FY
2008/H1
2007/FY
2007/H1
2006/FY
2006/H1
2005/FY
2005/H1
2004/FY
2004/H1
2003/FY
2003/H1
2002/FY
Stock NameRevenueRatio
境内集成电路分部879.45M65.29%
香港半导体材料配件分部447.38M33.21%
Other business divisions20.19M1.50%
Interdivisional offset-13.87K0.00%
