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Research Reports Gold Rush | Zheshang: Shengyi Technology is expected to welcome new growth opportunities in the future, maintaining a "Buy" rating.
On December 17, Gluonhui reported that Zheshang's Research Reports pointed out that since 2005, Shengyi Technology (600183.SH) has long been focused on tackling the technical challenges of high-frequency and high-speed packaging substrates. In the face of foreign technological blockades, the company, relying on its extensive technological accumulation, has developed a full series of high-speed products with different dielectric losses and various dielectric application requirements, as well as high-frequency products through multiple technical routes, and has achieved mass application of various products. Meanwhile, in the technology for copper-clad laminates used in packaging, the company's products have been widely used in areas such as card packaging, Led & Optoelectronics, and memory chips, breaking through key core technologies.
Shengyi Technology (600183.SH): It can be applied in fields such as AI Servers, AIPC, AI smartphones, and more.
On December 16, Gelonghui reported that Shengyi Technology (600183.SH) stated on the investor interaction platform that the company's Copper-clad laminates serve as hardware support for computing power, with corresponding product lines to meet different customer needs. The company's high-speed products have a full range layout, including Mid-loss, Low-loss, Very Low-loss, Ultra Low-loss, Extreme Low-loss, and higher-grade materials, which can be applied in fields such as AI Servers, AIPC, and AI phones.
Shengyi Technology (600183): Committed to independent innovation and actively embracing AI - Shengyi Technology review report.
Investment highlights of Global Copper foil leaders, based on terminal demand solutions. According to Prismark Statistics, from 2013 to 2022, Shengyi Technology has climbed to the second position in global sales of rigid Copper foil, with a global market share of.
Express News | Shengyi Technology: The company's sales of rigid copper-clad laminates ranked second in the Global market.
shengyi technology (600183.SH): has been mass applied in Wire Bond packaging substrate products.
On November 20, Gelonghui reported that shengyi technology (600183.SH) stated on the investor interaction platform that the company had made relevant technological arrangements in substrate materials for packaging substrates at an earlier stage, benchmarking against international leading enterprises in this field, covering different material technology routes, and developing exclusive substrate materials in collaboration with end-users. Different packaging forms have different material requirements; we have already seen mass application of Wire Bond type packaging substrate products, mainly used in the fields of sensors, card types, RF, cameras, fingerprint recognition, storage, and other product areas, and they have already seen mass application in advanced packaging fields.
Shengyi Technology Co.,Ltd. Just Missed EPS By 23%: Here's What Analysts Think Will Happen Next