THine Electronics: Announcement of entry into the low power consumption and low latency optical semiconductor business for the next generation PCI Express.
THine Electronics: Announcements of individual stocks regarding new entry into the data server business, including AI servers, and establishment of a subsidiary (results report).
THine Electronics: Notice Concerning the Recording of Non-Operating Income (Foreign Exchange Gains)
THine Electronics: Announcement of the launch of 13 megapixel PDAF compatible camera kits for NVIDIA Jetson Orin NX/Nano
THine Electronics: Developed 20Gb/s QPSK wireless transmission technology using the world's first mixed-signal baseband demodulator circuit
THine Electronics: Notice of completion of connection verification in LTE Cat.1 BIS communication module SIM7672g real network
Zine Electronics: (Progress of Disclosure Matters) Notice Concerning the Establishment of a Subsidiary
Zine Electronics: Notice regarding membership status of membership in the Financial Accounting Standards Organization Foundation and ways of thinking about enrollment, etc.
THine Electronics: Notice regarding new entry into the data server business such as AI servers and establishment of subsidiaries
Zine Electronics: Announcement of capital and business alliance between VAAK Co., Ltd. and Zain Electronics Co., Ltd.
Zine Electronics: Kappa Optronics announces adoption of THINE V-by-One (R) HS as a rear-view automotive CMS solution
Zine Electronics: Announcing that a contactless communication solution equipped with ST Microelectronics' high-speed proximity wireless technology jointly developed by SensorView and THINE will be exhibited at MWC
THine Electronics: Announcement of the start of providing camera image long-distance transmission kits compatible with the latest Raspberry Pi cameras
THine Electronics: Notice that disposable 4K endoscopes equipped with THINE products have obtained US FDA clearance and mass production will begin
THine Electronics: Notice of commencement of provision of Android-based wireless communication smart modules compatible with cameras and displays
THine Electronics: Combines THine's high-speed information transmission technology with ST Microelectronics' high-speed proximity wireless technology to support the expansion of contactless communication use cases
THine Electronics: Announcement on collaboration between THINE and DMP on edge AI camera solutions
THine Electronics: Notice of provision of V-by-One (R) technology for contactless transmission system research and development by the University of Tokyo D.Lab
THine Electronics: (Correction) Notice regarding changes in major shareholders and buyout acts stipulated by government ordinance as acts equivalent to tender offers
THine Electronics: Notice regarding changes in major shareholders and buyout acts stipulated by Cabinet Ordinance as acts equivalent to tender offers
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