Debang Technology (688035.SH): Products can be used for ASIC chip packaging.

On December 31, Glonghui reported that Debang Technology (688035.SH) stated on the investor interaction platform that the company's products can be used for ASIC chip packaging. ASIC stands for Application-Specific Integrated Circuit, which refers to a specialized chip customized for specific needs. The application of the company's products is not significantly related to whether the chip itself is dedicated or general purpose, but mainly relates to the packaging form and process of the chip, such as wire bonding, thinning, cutting, and flip chip.

Gelonghui FinanceDec 31, 2024 16:51

Debon Technology (688035): Plans to acquire Taijino in Cash to expand the layout of high-end thermal interface materials in application areas such as high computing power and advanced packaging.

Investment highlights: a cash acquisition of 89.42% of Taijino's shares is planned, with a focus on higher-end applications for high-performance thermal interface materials and continuing the deepening layout in the Semiconductors packaging materials field. A cash acquisition of 89.42% of Taijino's shares is planned. 2024

HAITONG INT'LDec 30, 2024 00:00

Express News | Over 30 A-share listed companies revealed the latest mergers, acquisitions and restructuring announcements this week, CNNC Technology plans to buy 71.965% of CNNC's shares and suspend trading tomorrow

BreakingsDec 29, 2024 18:04

Darbond Technology Plans to Acquire 89% Stake in Suzhou Taijino New Material Technology

MT NewswiresDec 27, 2024 15:37

Express News | Debang Technology: Plans to acquire 89.42% of Taijino's equity for 0.258 billion yuan.

BreakingsDec 26, 2024 18:20

Debang Technology: Multiple chip-level packaging materials have been introduced and are expected to increase in volume. It is anticipated that the domestication rate of semiconductor materials will steadily grow this year | Focus on the earnings conferenc

① The company's integrated circuit sector currently generates sales mainly from a series of products including UV films, die attach materials, thermal conductive materials, and other chip packaging materials; ② Jie Haihua stated that the domestic production rate of semiconductor materials is still at a low level, with great potential, and many products are in the certification and expansion stages, expecting a steady growth trend this year.

cls.cnDec 9, 2024 21:29