Novoray Corporation: Spherical Titanium Oxide and other products are now being supplied in bulk. The market for more high-value filler products is being opened up | Direct report from the Earnings Conference.

① The company stated that since the beginning of the year, the sales of filler products used in the thermal interface field have been gradually increasing, and the capacity utilization rate of spherical products has further improved. In the fourth quarter, the company's operational status has been stable, meeting the company's development expectations; ② In addition to silicon aluminum oxide products, a series of high-end applications such as spherical Titanium and liquid fillers used in high dielectric high-frequency substrates have passed certification from domestic and international customers and have been shipped in bulk.

cls.cnDec 18 18:09

Multiple countries are increasing support for the semiconductors industry, and the sector's performance is expected to improve quarter by quarter.

Recently, multiple countries have increased their support for the development of the semiconductor industry. On November 29th, the German government is preparing to provide billions of euros in new investment to the country's semiconductor industry. On November 27th, to support the development of the semiconductor industry, South Korea's Ministry of Finance announced plans to introduce 14 trillion Korean won (approximately 72.8 billion Chinese yuan) in low-interest loans next year.

cls.cnDec 2 07:53

Novoray Corporation (688300.SH): The company's products can be applied in the packaging materials of ai chips.

On November 27, Gelonghui reported that novoray corporation (688300.SH) stated on the interaction platform that the current mainstream global packaging technologies are primarily CSP and BGA. In the AI field, chips need to have high-performance computing capabilities, often using advanced packaging forms that are high-performance and high-density, such as system-in-package (SIP), three-dimensional packaging (3D), and fan-out wafer-level packaging (FOWLP). These technologies place higher demands on packaging processes and materials. For packaging fillers, it is essential to not only have ultra-fine particle sizes, low CUT points, and high thermal conductivity, but also to possess high purity, safety, and several other attributes.

Gelonghui FinanceNov 27 16:05

Express News | Kaiyuan Securities: Domestic semiconductor industry chain accelerating penetration, focusing on three directions.

BreakingsNov 14 10:59

novoray corporation (688300.SH): indirect customers are integrated circuit packaging and testing manufacturers

Novoray Corporation (688300.SH) stated on the interactive platform on November 11th that the entire integrated circuit industry chain includes four stages: chip design, manufacturing, packaging, and testing, ultimately delivering the manufactured chips to end customers. The company's products belong to the upstream materials of the integrated circuit packaging process, with direct customers downstream being manufacturers in the fields of epoxy molding compound (EMC), liquid molding compound (LMC), granular molding compound (gmc), and underfill materials, as well as electronic circuit substrates for copper clad laminates (CCL), with indirect customers being integrated circuit packaging and testing manufacturers. Nvidia.

Gelonghui FinanceNov 11 16:56

Novoray Corporation (688300): The proportion of high-end products has increased, and performance remains on a good growth trajectory.

Item: The company released the third quarter report for 2024, achieving revenue of 0.25 billion yuan, yoy +27.25%; achieving net income attributable to the parent company of 0.067 billion yuan, yoy +30.10%; attributable to the parent net income after deducting non-recurring gains and losses of 0.

Ping An SecuritiesOct 31 00:00