Product
Currency:CNY
2024/H1
Stock NameRevenueRatio
系统级封装产品786.6M48.27%
扁平无引脚封装产品509.92M31.29%
高密度细间距凸点倒装产品271.25M16.65%
晶圆级封测产品34M2.09%
Other business25.65M1.57%
Other products2.05M0.13%
View all
Industry
Currency:CNY
2023/FY
Stock NameRevenueRatio
Integrated circuit packaging test2.38B99.64%
Other business8.55M0.36%
Region
Currency:CNY
2024/H1
Stock NameRevenueRatio
Territory1.41B86.44%
Overseas220.97M13.56%