Industry giants are fully expanding their SoIC production capacity, and the advanced packaging industry chain continues to benefit from technological progress.

According to industry sources, due to strong demand from the four major customers, taiwan semiconductor is also fully expanding its SoIC production capacity. By the end of this year, the monthly production capacity will increase from about 2,000 wafers at the end of 2023 to 4,000-5,000 wafers, and there is a chance to exceed 8,000 wafers in 2025. Yongxing Securities believes that the importance of advanced packaging in the era of computing power is gradually emerging, and the related industrial chain is expected to continue to benefit.

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