[Data Analysis] Block orders of IM futures significantly increased their long positions, with funds from multiple sources joining hands to rush to subscribe to China Wafer Level CSP.
①The main contract for IM futures saw a significant increase in long positions by over 7,000 lots, with the number of additional positions clearly exceeding the short positions. ②Chip stock China Wafer Level CSP attracted institutions, speculative funds, and algo funds to buy in, with Huaxin Securities Shanghai Wanping South Road branch buying 0.26 billion.
Witness history! The sse composite index surged by 10%! All A-share brokerages hit the limit up! Semiconductors almost all hit the limit up.
After the National Day holiday, the A-share king is back!
Focusing on the semiconductor and optical main business, Medikay's subsidiary introduce a strategic investment with a valuation of 1.8 billion yuan.
MediCare said that the additional capital will mainly focus on the company's core business, such as equipment construction required for product mass production, R&D funding for new projects, etc. Insiders said that unlike regular financial investors, in addition to financial investment, The FTA Fund will also use its own resource accumulation in the semiconductor field to empower Zhejiang MediCare's business and achieve higher investment ROI.
The storage giant plans to use nano-printing technology, and local manufacturers are expected to face overtaking opportunities at bends
① According to reports, Micron Technology plans to take the lead in supporting Canon's nano-printing technology to further reduce the cost of producing a single layer of DRAM memory chips. ② According to TechnaVio data, the nanoimprinting market is expected to reach 3.3 billion US dollars in 2026, with a compound growth rate of 17.74% from 2021 to 2026.
TSMC's advanced packaging production capacity is in short supply, and domestic packaging and testing manufacturers are expected to accept spillover orders
① TSMC held a corporate briefing. CEO Wei Zhejia pointed out that demand for advanced AI chip packaging continues to be strong. Currently, production capacity is still unable to meet strong customer demand, and the shortage of supply may continue until 2025. ② Tianfeng Securities said that TSMC has launched a CoWoS production expansion plan, and some CoWoS orders have spilled over, and major local testing companies are expected to benefit from it.
Medicare: RF wafer packaging production capacity reaches 4000 K/month, nano-imprint products are expected to be shipped in batches in Q1 next year | Direct impact on the performance meeting
① Hua Zhaohua, secretary of the board of directors of Medicare, said that the company's nanoimprinting technology can be applied to the semiconductor field; ② Ge Wenzhi said that in terms of RF wafer packaging, small-batch production was achieved in January this year, and up to now, production capacity has reached 4K/month.