Express News | LG is developing AI chips for home appliances.
taiwan semiconductor's strong performance once again ignites the AI craze! Will the AI sector usher in a new round of uptrend?
Wedbush analyst believes that with the establishment of the next generation ai infrastructure, by 2027, the size of the entire ai infrastructure market dominated by nvidia's AI GPU may increase significantly by 10 times. It is estimated that capital expenditures in the field of ai will reach 1 trillion US dollars in the next three years.
Express News | Huaxing Securities: taiwan semiconductor's positive development momentum is expected to continue until the first half of 2025.
taiwan semiconductor 2nm, no competitor
taiwan semiconductor currently has known 2-nanometer fab plans totaling 7 fabs, which will be the most fabs in the company's history, surpassing competitors Samsung and intel, symbolizing taiwan semiconductor's dominance in advanced processes, playing out like a martial arts master.
TSMC's Positive Momentum Could Sustain Into 1H 2025 -- Market Talk
Ningbo Boway Alloy Material (601137.SH): The company will not directly cooperate with Taiwan Semiconductor.
Jiuzhouhui, October 21st. Ningbo Boway Alloy Material (601137.SH) stated on the investor interaction platform that the company will not directly cooperate with Taiwan Semiconductor. However, the company's lead frame special materials will be used for chip packaging before the third generation; The socket base special material is mainly used to connect advanced packaging chips and substrates. With the development of AI, the market focuses on AI computing chips. Advanced packaging is an important way to package AI computing chips. The socket base connection method can be applied to chips produced in more advanced packaging methods.